PCB Impedance Calculator
Calculate the characteristic impedance of PCB traces based on dimensions, materials, and layout.
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Understanding PCB Impedance
PCB impedance is a critical parameter in high-speed digital and RF circuit design. It represents the opposition that a trace offers to the flow of alternating current, combining both resistance and reactance properties. Controlling impedance is essential for signal integrity, minimizing reflections, and ensuring proper circuit function.
Why PCB Impedance Matters
As signal frequencies increase, traces on PCBs start to behave as transmission lines rather than simple connections. When the signal propagation time along a trace becomes comparable to the rise/fall time of the signal, impedance matching becomes crucial to prevent reflections and maintain signal integrity.
Key Benefits of Controlled Impedance
- Minimizes signal reflections that cause ringing and overshooting
- Reduces electromagnetic interference (EMI)
- Ensures proper signal timing and prevents data errors
- Enables higher data rates and frequencies
- Ensures compatibility with standard interfaces (USB, HDMI, PCIe, etc.)
Types of PCB Transmission Lines
Microstrip Line
A microstrip is a trace on the outer layer of a PCB with a ground plane beneath it. One side of the trace is exposed to air (or solder mask), while the other side faces the dielectric material.
┌───────┐ │ Trace │ ← W (width) ┌───┴───────┴───┐ ↑ │ PCB │ │ H (height) └───────────────┘ ↓ │/////////////│ ← Ground Plane
Microstrip Impedance Formula (Approximate):
Z₀ = (87 / √(εᵣ + 1.41)) × ln(5.98 × H / (0.8 × W + T))
Stripline
A stripline is a trace embedded between two ground planes inside the PCB. The trace is completely surrounded by dielectric material, providing better shielding and isolation.
|/////////////| ← Top Ground Plane └───────────────┘ ↑ │ PCB │ │ H (height) ┌───┬───────┬───┐ │ │ │ Trace │ │ ↓ └───┴───────┴───┘ |/////////////| ← Bottom Ground Plane
Stripline Impedance Formula (Approximate):
Z₀ = (60 / √εᵣ) × ln((2 × H) / (0.8 × W + T))
Key Parameters Affecting PCB Impedance
- Trace Width (W): Wider traces have lower impedance. This is typically the parameter adjusted to achieve target impedance.
- Trace Thickness (T): Standard copper weights (1 oz = 35 μm) affect impedance. Thicker copper lowers impedance slightly.
- Dielectric Height (H): The distance between the trace and ground plane. Greater height increases impedance.
- Dielectric Constant (εᵣ): Material property that affects impedance. Higher dielectric constants lower impedance. Typical FR-4 values range from 3.8 to 4.6.
- Trace Geometry: Edge coupling, surface roughness, and etch factor can all affect the actual impedance of a trace.
Common Standard Impedances
50Ω
Standard for single-ended RF circuits, test equipment, and many high-speed digital interfaces. Optimized for power transfer in RF applications.
75Ω
Used for video applications, cable TV connections, and some RF applications. Optimized for voltage transfer with minimal loss.
100Ω (Differential)
Standard for differential pairs in USB, Ethernet, PCIe, HDMI, and other high-speed interfaces. Each trace in the pair is typically designed for 50Ω single-ended impedance.
PCB Impedance Control Best Practices
- Always specify impedance requirements to your PCB manufacturer
- Include test coupons on production panels for impedance verification
- Maintain consistent trace widths throughout controlled impedance paths
- Avoid sharp corners (use 45° angles or curves) on high-frequency traces
- Keep traces away from board edges and other sources of impedance discontinuity
- Consider using specialized RF-grade PCB materials for critical applications
- Account for manufacturing tolerances in your design calculations
Important Note
While this calculator provides good estimates of PCB impedance based on standard formulas, actual impedance can be affected by many factors including manufacturing tolerances, material variations, and trace geometries. For critical applications, verify designs with electromagnetic field solvers and prototype testing.
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